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EBSO SPA 200 選擇性波峰焊

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13795305235
品牌
EBSO
型號(hào)
SPA200
用途
直插元件焊接
品牌EBSO型號(hào)SPA 200用途直插元件焊接別名選擇性波峰焊

spa 200
automatic selective soldering system

ebso spa 200
reliable soldering at easy operation and highestflexibility

the ebso spa200- is a high flexible miniwave soldering system ata power rate of3,5 kw only at 220 v
a xyz axis carrier system moves the pcb over the fluxer, preheaterand solder module. to reduce oxide in the solder bath andespecially for high solder results nitrogen is provided tothe solder bath and solder pump unit.
bath and pump is made of titanium ready for lead free solderalloy.

the spa200. is designed for selective soldering through holecomponents like connectors, transformers, relays, coils etc.

a large selection of nozzles for all component shapes and sizesassures best results for different applications.
theebso offline editoris a windows basedprogramming software.

the easy?point&click“procedure makes itpossible to produce a soldering program within a few minutes.

e of the spa 200

titanium solder bathstandardflux module with precise microdrop fluxerstandard2 liter stainless steel flux pot incl. flux levelmonitoringstandard

siemens panel with s7 plc incl.
n2 monitoring, exhaust monitoring

standard1 standard universal-l?trahmenstandarduniversal-solder-frame one standard nozzleoptional

ebso selective soldering system spa 200

the ebso spa200 is an automatic selective soldering system.solder bath and solder pump is covered with nitrogen. designed forautomatic soldering of connectors, transformers, coils and otherconventional components. especially for applications which are notsuitable for a wave soldering process or to automize handsoldering.

e base system

-xyz – axis carrier system +-0,1 mm-transportangle 7° (optional 0°)-max. pcb size 200 x 200 mm-max. frame/fixture size 240 x 240 mm-microdrop fluxer for single point and line fluxing with 2 lflux pot and flux level control-20 kg titanium pot and pump unit suitable for lead free solderalloys-universal solder frame and one standard solder nozzle-siemens panel-exhaust control sensor-n2 control, solder level control, flux level control-light-tower-nozzle changeover tooling, safety cloves, solder tool
統(tǒng)一社會(huì)信用代碼
310115400172590
成立日期
2005年04月05日
法定代表人
LEE CHEE CHON
注冊(cè)資本
美元25萬(wàn)

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專業(yè)為電子制造加工及其相關(guān)行業(yè)提供先進(jìn)的半導(dǎo)體制造線,SMT生產(chǎn)設(shè)備和電子工業(yè)輔料;代理和銷售優(yōu)質(zhì)的電子焊接設(shè)備,清洗設(shè)備,涂布設(shè)備等半導(dǎo)體加工及電子加工相關(guān)設(shè)備,中古二手SMT設(shè)備及備品備件,并提供完善的技術(shù)支持和售后服務(wù). 公司擁有多年電子行業(yè)經(jīng)驗(yàn)的銷售和服務(wù)人員,發(fā)揮全球強(qiáng)大的銷售和服務(wù)網(wǎng)絡(luò)優(yōu)勢(shì),積極推廣高新產(chǎn)品和技術(shù)的應(yīng)用,為客戶提供優(yōu)質(zhì)完善的電子行業(yè)全套解決方案.公司網(wǎng)站:www.sip-technology.com...

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