用途/USAGE

適用于覆蓋膜（CVL）、柔性板（FPC）、軟硬結(jié)合板（RF）和薄多層板的切割成形，以及開窗盒揭蓋；可擴(kuò)展用于切割各種基材，如陶瓷、硅片等。Themachine is used in cutting,opening the window and uncovery forCVL/FPC/RF and thin multilayer board,as well ascutting a variety of substrates, suchas ceramic,silicon etc.

特征/CHARACTERISTICS

真正冷加工，基本無(wú)炭化；

Completely coldcutting, almost no carbonizing.

效率高，相對(duì)納秒加工，切割速度可以提高數(shù)倍；

High effiency,timesspeed higher than nano laser cutting.

雙臺(tái)面，零上下料時(shí)間，題升加工效率；

Easy to usesoftware interface,easy to learn.

加工前預(yù)覽功能，避免切板報(bào)廢；

Preview functionbefore processing to avoid damaging sample.

相對(duì)于納秒激光加工，碳化極其微弱;

Carbonization isextremely weak compared to nanosecond laser processing.

相對(duì)于納秒加工，速度可提高數(shù)倍；

Speed can beincreased several times compared to nanosecondprocessing.

加工面更加精細(xì)光滑，整齊，干凈；

The processingsurface is more fine, smooth, tidy and clean;

除了傳統(tǒng)的電路板高分子材料和銅箔等加工，皮秒還可以加工，陶瓷，硅片，鐵氟龍等材料；

In addition totraditional circuit board polymer materials and copper foilprocessing, picoseconds can also be processed, ceramics, siliconwafers, Teflon and other materials;

支持EMCS,MES系統(tǒng)，利用識(shí)別二維碼自動(dòng)取舍切割圖形單元；

Support EMCS, MESsystem, use the identification of two-dimensional code toautomatically select and cut the graphics unit;