lead-free solder paste

bl-900無(wú)鉛助焊膏

（無(wú)配方生產(chǎn)高品質(zhì)錫膏方案）

說(shuō) 明書(shū)

  bl-900無(wú)鉛助焊膏，是專(zhuān)用于生產(chǎn)smt無(wú)鉛錫膏，，采用全進(jìn)口優(yōu)級(jí)原材料研制合成，制作產(chǎn)品可以滿(mǎn)足客戶(hù)不同產(chǎn)品的工藝要求,適用生產(chǎn)各種合金粉焊錫膏見(jiàn)(表1)

 bl-506 lead-free solderpaste is a dedicated lead-free solder paste on the smt productionprocess welding activity to help paste, using superior gradejapanese development of synthetic materials to produce products tomeet customer process re of different products suitablefor producing all kinds of alloy powder paste,see(table1)

產(chǎn)品特性：

1：本產(chǎn)品是免清洗焊膏，殘留很少，無(wú)需清洗。
2：殘留物是無(wú)色透明的,快干不粘手,較高的絕緣阻抗,不會(huì)腐蝕pcb。
3：優(yōu)良印刷優(yōu)良的性能，適用于手工和機(jī)器印刷。
4：連續(xù)印刷性能穩(wěn)定，其粘度變化極小,鋼網(wǎng)上操作壽命可長(zhǎng)達(dá)8小時(shí),保持良       好的印刷性能。
5：可適用不同檔次的焊接設(shè)備要求,在較寬的回流焊爐內(nèi)表現(xiàn)良好的焊接性能。
6：能夠適應(yīng)0.3mm間距印刷要求。
7：良好的潤(rùn)濕性能，有效解決冷焊點(diǎn)等不良現(xiàn)象。
8：濕度曲線的技術(shù)，減少對(duì)各種曲線的依賴(lài)。
9：焊后殘留極少極少腐蝕錫珠。
10：錫點(diǎn)，光澤度好，強(qiáng)度高，良好的電氣性能。
11：尤其是柔性電路，預(yù)熱時(shí)間可能很短，,都可達(dá)到優(yōu)良的焊接效果。

12：本焊膏生產(chǎn)的成品,濕潤(rùn)性好,抗發(fā)干性和防冷熱塌陷極好。

1,the product features:
1: this product is no-clean solder paste, very little residue, nocleaning.
2: the residue is colorless and transparent, non-stickin hand, high insulation        resistance,corrosion will not be pcb.
3: fine print excellent performance, suitable for hand and machineprinting.
4: continuous printing performance is stable, its viscosity changesvery little, the steel line operating life of up to 8 hours, andmaintain good printing performance.
5: applicable to different grades of welding equipmentre, the performance of a wide reflow furnace good weldingperformance.
6: able to adapt to 0.3mm pitch printing re.
7: good wetting properties, an effective solution to cold solderjoints and other undesirable phenomena.
8: humidity curve technology to reduce dependence on the variouscurves.
9: very little very little corrosion after welding residual solderball.
10: tin point, good gloss, high strength, good electricalperformance.
11: in particular, flexible circuits, preheating time may be veryshort, can achieve good welding effect.
12: the production of finished paste, moist and good, anti-hair dryand anti-collapse excellent hot and cold.

合金粉配比

(表1)

合金成份

焊膏比例

合金成份

焊膏比例

sn96.5ag3.0cu0.5

11.2-11.5

sn42bi58

10-10.5

sn99ag0.3cu0.7

11.2-11.5

sn63pd37

10-10.5

使用/注意

1、焊膏保存溫度在常溫5-20℃，勿接近高溫處。

2、使用前將焊膏攪拌均勻，倒入合金粉攪拌。

3、攪拌時(shí)間根據(jù)合金粉份量來(lái)定，參考時(shí)間:（攪拌機(jī)攪拌5-12分鐘）.

4、攪拌溫度控制20-25℃，在攪拌過(guò)程中合金粉磨擦?xí)a(chǎn)生溫度會(huì)上升，注意觀查合金粉變化。

5、手工攪拌要在干燥空氣中操作，使用不銹鋼材料攪拌。勿使用其它金屬成份接觸錫膏。

third, use / attention

1,paste stored at room temperature, the temperature5-20℃,not to close to heat.
2 stir before using the paste, stirring into the alloy powder.
3, stirring time under the weight of alloy powder to set, referencetime: (mixer 5-12 minutes).
4, mixing temperature control 20-25℃,the alloy powder in the mixing process will produce frictionbetween the temperature will rise, pay attention to changes in viewof investigation alloy powder.
5, handmixing in dry air to operate, so that stainless steelmixing.do not use the othermetal components contact solder paste.

                                       免費(fèi)提供技術(shù)支持：

                                                qq: 422530988

焊豐電子材料有限公司：
批發(fā)：smt紅膠 富士紅膠
           bga焊膏無(wú)鹵焊膏
          生產(chǎn)錫膏專(zhuān)用：
           無(wú)鉛焊膏bl-900 (錫膏生產(chǎn)-免費(fèi)技術(shù)支持)
           本焊膏采用全進(jìn)口材料配制，專(zhuān)用于生產(chǎn)的錫膏專(zhuān)用。
           特點(diǎn)：
           1.無(wú)異味，錫點(diǎn)光亮，光滑，殘留極少，殘留物是白色透明，
           2.鍍金，鍍鎳板都可以使用，無(wú)連錫現(xiàn)象,適用于高精密smt電路焊接。
           3.無(wú)錫珠，抗發(fā)干性極好，保濕性能極強(qiáng)?？刹僮?4小時(shí)正常
            聯(lián)系人：方生
           手機(jī)：
           q q:    422530988

本產(chǎn)品的品牌是焊豐，型號(hào)是BL-900，加工定制是是，粘度是190（Pa·S），顆粒度是25-45（um），合金組份是25，活性是酸性，類(lèi)型是免洗，清洗角度是1，熔點(diǎn)是250，規(guī)格是10kg