用途/USAGE

適用于覆蓋膜（CVL）、柔性板（FPC）、軟硬結(jié)合板（RF）和薄多層板的切割成形，以及開窗盒揭蓋；可擴展用于切割各種基材，如陶瓷、硅片等。The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board,as well as cutting a variety of substrates, such as ceramic,silicon etc.

特征/CHARACTERISTICS

真正冷加工，基本無炭化；

Completely cold cutting, almost no carbonizing.

效率高，相對納秒加工，切割速度可以提高數(shù)倍；

High effiency,times speed higher than nano laser cutting.

雙臺面，零上下料時間，題升加工效率；

Easy to use software interface,easy to learn.

加工前預覽功能，避免切板報廢；

Preview function before processing to avoid damaging sample.

相對于納秒激光加工，碳化極其微弱;

Carbonization is extremely weak compared to nanosecond laser processing.

相對于納秒加工，速度可提高數(shù)倍；

Speed can be increased several times compared to nanosecond processing.

加工面更加精細光滑，整齊，干凈；

The processing surface is more fine, smooth, tidy and clean;

除了傳統(tǒng)的電路板高分子材料和銅箔等加工，皮秒還可以加工，陶瓷，硅片，鐵氟龍等材料；

In addition to traditional circuit board polymer materials and copper foil processing, picoseconds can also be processed, ceramics, silicon wafers, Teflon and other materials;

支持EMCS,MES系統(tǒng)，利用識別二維碼自動取舍切割圖形單元；

Support EMCS, MES system, use the identification of two-dimensional code to automatically select and cut the graphics unit;